Our expapplicationertise encompasses a broad range of electronic materials including Mono Crystalline and Poly Crystalline Silicon, Sapphire ,Quartz, Specialty glasses, and a variety of other hard compounds and ceramics. Whether your concern is part quality or productivity, “MORESUPERHARD ” dicing blades step up to the challenge.
Our standard and custom specifications are available in a variety of bond, hardness and diamond or cubic boron nitride(CBN) Grain sizes to meet your material removal, Heometry , chipping, and surface finish requirements. We also offer the broadest range of blade sizes and bond systems including sintered and plated metal as well as resin for maximum engineering flexibility.
Our cutting discs are mainly including Resin diamond dicing blade, Metal bond dicing blade and Electroplated bond dicing blade.
Specification of diamond cutting discs (including resin bond , electroplated bond and metal bond ):
Resin/Electroplated/Metal bond dicing blade
0.10-2.00mm (Based on diamond grit size)
According to customers’ requirement Email: firstname.lastname@example.org
NO.1 Resin diamond dicing blade
Introduction of Resin bond dicing blade:
Resin bond blades with the characteristic of vertical consumption can efficiently reduce the occurrence of grain deformation and improve the cutting quality and efficiency on hard and brittle materials.
Features of Resin bond dicing blade:
Improve the cutting quality and efficiency on hard and brittle materials.
A wide selection of bonds available for high-grade processing on hard and brittle materials.
Ultra thin blade (over 50um)
Applications of Resin bond dicing blade:
Hard and Brittle Materials, Ceramics, Optical Glass, Glass for Optical Fiber Communication, Splitter, IR Filter, QFN
The pictures of Resin bond dicing blade:
NO.2 Metal bond dicing blade
Introduction of Metal bond dicing blade:
Metal bond blades, the sintered diamond blades with the addition of metal powder in bond, have high retaining force for grain.
With the higher wear-resistance and advanced cutting capability and higher stiffness, the metal bond blades can effectively reduce cutting defects like slanted-kerf.
Features of Metal bond dicing blade:
Ultra thin blade (over 45um)
A wide selection of bonds available for various semiconductor packages.
Applications of Metal bond dicing blade:
The pictures of Metal bond diamond saw blade:
D300*H60*2.0/1.6*21 Metal diamond saw blade is mainly used for machining of ceramic tiles
Introduction of Electroformed bond dicing blade:
Electroformed bond blades are featured by ultra thin, high strength and
stiffness. They can also suppress the deformation of blade shape and
give high endurance and robust properties during cutting process.
Features of Electroformed bond dicing blade:
A wide selection of bonds available for various kinds of workpieces.
Exclusive development and customization technology.
Applications of of Electroformed bond dicing blade:
Compound, Silicon, Magnetic Materials, Ceramic Raw Material
Ceramic, Glass Epoxy Boards, etc.
The pictures of Electroplated bond dicing blade: