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Diamond Dicing Blades

diamond dicing blades

Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry.

The Type: diamond hub dicing blade and diamond hubless dicing blade

Electroformed diamond hub dicing blade

Electroformed dicing 

blade

Features: 

Easy to handle ultra-thin blade; Blade dicing

after laser grooving; Variety of different grit 

concentrations; Shows stable processing 

performance in high load processing




Hub dicing blade

Application:  Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)

 

resin dicing blade


   resin dicing blade

Features: 

High processing quality for cutting of hard, brittle materiais; Able to precisely control diamond concentration to achieve cutting quality; Improved cut quality on hard materials 

 










Hubless dicing 

blade

Application:

Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter 

 metal dicing blade

  

   metal dicing balde

Features: 

High rigidityminimized wavy and slant cutti

g ; Able to control diamond concentration to 

achieve cutting quality ;Excellent rigidit and 

cut quality

Application:  Electronic parts, Optical devices, semiconductor packages, BGA, CSP, 

Electroformed dicing balde

Electroformed dicing 

balde

Features: 

Wide selection of blade optionsProprietary 

thin-blade technology ;Blade thickness - 0.0

15 mm to 0.3 mm; Available for both dicing

saws and slicers

Application:  Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon 

Other specification can be produced according to customers requirements     sales@moresuperhard.com  

TEL: 0086-371-86545906 e-mail: sales@moresuperhard.comAre you interested in tool
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