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Vitrified bond Diamond Wheel for PCD CBN Tools Grinding

2019.07.03More SuperHard Products Co., Ltd49

vitrified bond diamond grinding wheel

6a2 vitrified diamond grinding wheelPCD and CBN cutting tools are widely used in metal cutting and processing nowadays. The quantity demanded has a 20 times increased in last 5 years. To fit the social more complex needs and rapid development of science and technology, tools manufacturer’s demands for higher precision and better grinding efficiency are also increasing as well. “More Super Hard Products” devotes to offer an efficiency and economic solution in PCD and CBN cutting tools grinding.

Improved bond systems

Besides choice of the correct diamond girt, the bond system is the key to get superior grinding result. Great effort is made to innovate and improve the previous bond system. Several exclusive bond system lines (no porosity series, high porosity series) are offered to meet different grinding purpose.

Super-fine girt size available

With the demand of extremely smooth cutting edge, we recommend super-fine grit size wheel to customers. D3(4000#) and D7(3000#) grit size now are available, they provide you superior cutting edge chipping <5 μm.

PCD Grinding Wheel super fine vitrified diamond grinding wheel

Features of vitrified bond diamond grinding wheel for pcd cbn tool grinding

Shorter set-up times

Easy to dress

Stable grinding performance based on improved bond system

Cutting-edge chipping <5 μm through the use of super-fine grit size

Multiple bond systems aim at different working condition

Recommended Parameter

Grinding wheel speed ---- 14 ~ 26 m/s

Dressing wheel speed ---- 6 ~ 26 m/s

Dressing amount ;---- 0.02 ~ 0.05 mm

Oscillation ; ---- 10 ~ 120 passed/min

vitrified diamond wheel for pcd cbn tool grinding

Application example 1: PCD Inserts Grinding Vitrified bond Diamond Grinding Wheel

Grinding machine

EWAG EasyGrind




PCD insert (brazed, include carbide )

Grinding Parameters

Feed Rate

Vf = 2mm/min



Cutting Speed



1, 35%-time savings
2, 20% working life time increase
3, Chipping < 10μm


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