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Home > Products > Superabrasive Wheels > Diamond Dicing Blades > Electroformed hub dicing blade

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Electroformed hub dicing blade

Electroformed hub dicing blade

Eelectroformed hub dicing blade is used for cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass

Alias: hub dicing blade, dicing blade
Application: silicon wafer, copper wafer
Details

Electroformed hub dicing blade is made by using an ultra-thin diamond wheel and a high precision aluminum alloy hub.

Applications of hub dicing blade

Cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass

The features of hub type dicing blade

* Improving balance between blade life and processing quality (in particular backside chipping)

* Strengthens rigidity, Reduction in wavy cutting and blade wear under high load conditions

* Precise control of diamond grit size, diamond concentration, and nickel bond hardness to reduce splitting on the edges

* Realizes high speed wafer cutting after laser grooving

The specifications of hub type dicing blade

Exposure(μm)          380510640760890102011501270Grit Size
Kerf width(μm)            380-510510-640640-760760-890890-10201020-11501150-12701270-1400#5000 #4800 #4500 #4000 #3500 #3000 #2500 #2000 #1800 #1700 #1500
16-2020*38020*510





21-2525*38025*51025*640




26-3030*38030*51030*64030*76030*89020*1020

31-3535*38035*51035*64035*76035*89035*1020

36-4040*38040*51040*64040*76040*89040*102040*1150
41-5050*38050*51050*64050*76050*89050*102050*1150
51-60
60*51060*64060*76060*89060*102060*115060*1270
61-70

70*64070*76070*89070*102070*115070*1270
71-80



80*89080*102080*115080*1270
81-90




90*102090*115090*1270
Inquiry
Electroformed hub dicing blade
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