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Electroformed hub dicing blade

Electroformed hub dicing blade

Eelectroformed hub dicing blade is used for cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass

Alias: hub dicing blade, dicing blade
Application: silicon wafer, copper wafer
e-mail: sales@moresuperhard.com
Details

Electroformed hub dicing blade is made by using an ultra-thin diamond wheel and a high precision aluminum alloy hub.

Applications of hub dicing blade

Cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass

The features of hub type dicing blade

* Improving balance between blade life and processing quality (in particular backside chipping)

* Strengthens rigidity, Reduction in wavy cutting and blade wear under high load conditions

* Precise control of diamond grit size, diamond concentration, and nickel bond hardness to reduce splitting on the edges

* Realizes high speed wafer cutting after laser grooving

The specifications of hub type dicing blade

Exposure(μm) 380 510 640 760 890 1020 1150 1270 Grit Size
Kerf width(μm) 380-510 510-640 640-760 760-890 890-1020 1020-1150 1150-1270 1270-1400 #5000 #4800 #4500 #4000 #3500 #3000 #2500 #2000 #1800 #1700 #1500
16-20 20*380 20*510
21-25 25*380 25*510 25*640
26-30 30*380 30*510 30*640 30*760 30*890 20*1020
31-35 35*380 35*510 35*640 35*760 35*890 35*1020
36-40 40*380 40*510 40*640 40*760 40*890 40*1020 40*1150
41-50 50*380 50*510 50*640 50*760 50*890 50*1020 50*1150
51-60 60*510 60*640 60*760 60*890 60*1020 60*1150 60*1270
61-70 70*640 70*760 70*890 70*1020 70*1150 70*1270
71-80 80*890 80*1020 80*1150 80*1270
81-90 90*1020 90*1150 90*1270
Inquiry
Electroformed hub dicing blade
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    E-mail: sales@moresuperhard.com

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