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Dicing Blade selection for wafer cutting

2021.04.08More SuperHard Products Co., Ltd62

At present, most of the wafer cutting is using high precision scribing machine, which is mainly mechanical processing.

Under the action of mechanical stress, the wafer is prone to quality abnormalities after cutting. Common quality abnormalities include: product surface, back Chipping, PAD oxidation, delamination, missing Angle and other abnormalities.

Main product for wafer cutting

Dicing Blade

Mounting Tape

DI Water


Comressed Air, N2.

Main parameters of dicing processing

Cutting pattern

Feed speed

The blade rotation speed Cutting depth

Cooling water flow

How to choice of diamond dicing blades

1. Grit

2. Concentration

3. Binding agent characteristics

4. Blade length

5. Blade thickness

Usually, use SD (synthetic diamond) with particle sizes from 1μm to 8μm for cutting wafer, In order to achieve better cutting quality, diamond particles with edges and corners is better.

dicing blade

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