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Applications

Semicon Industry Solutions
PCD & PCBN Tools Grinding Industry
Auto Processing Industry
Diamond Cutting Bruting Polishing
Thermal Spray Coating Industry
CNC Tools Grinding Industry
Wood Working Tools Industry
Optical glass industry
Glass Processing Industry
Roll Machining Industry
Petroleum & Geology Industry
Precision Ceramic Grinding and Polishing

Semicon Industry Solutions

2021.03.30More SuperHard Products Co., Ltd221

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The semiconductor industry is a key cornerstone of the modern information society. With the accelerated evolution of new technological changes such as artificial intelligence and the Internet, the development of the electronic information industry has entered a new round of upgrading and transformation. The demand for the semiconductor market is also growing. The global semiconductor industry has bucked the trend and increased by 6.5%. China is the world's largest semiconductor market.
A wafer is a thin slice of semiconductor material used to fabricate integrated circuits or other microdevices1. Also called a slice or substrate, wafers must undergo a number of steps in the preparation process before they are ready for use.

Manufacturing processes for silicon semiconductor

Silicon Ingot  ⇒ Cropping(electroplated bandsaw) ⇒ Cylindrical / Flat Grinding Silicon Rod ⇒ Ingot Silicon (diamond wire) ⇒ Lapping (double side wheel/polishing pad) ⇒ Edge Grinding ⇒ Surface grinding ⇒ polishing⇒ wafer⇒ patterning ⇒ back grinding (vitrified / resin wheels) ⇒ dicing (dicing blades)⇒ chips ⇒ molding ⇒ packaging


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More Superhard provides diamond tools for the semiconductor industry including


► Diamond Bandsaw Blades  

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 Cutting silicon ingot in semiconductor industry. Thery are also cut sapphire ingot , quartz glass, et

cEdge shapes diamond bandsaw blades: continuous, segmented ( half moon) and serrated shape









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► Cylindical / Surface Grinding Wheels

Peripheral grinding of silicon ingots, or processing the outer surface of silicon ingots and to make orientation flat









► Edge Grinding Wheel    详情图1.jpg

Edge wheel/ chamfering wheels for silicon and sapphire wafer edge grinding. A small diamterer wheel for notch grinding












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Back Grinding Wheels

Back grinding wheels are used for the thinning and fine grinding of the silicon wafer.











► Dicing Blades ( Hub type and Hubless type) dicing blade.jpg

Ultra - thin diamond dicing blade ( hub type and hubless type) for scribing silicon wafers, compound semiconductor wafers (GaAs, Gap)












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► PU Polishing Pad

Polishing and finishing of glass, LCD/LED substrates, precision optics, hard disk, metal and semiconductor wafer surfaces











Inquiry

Semicon Industry Solutions
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